Why EMI Resilience Must Be Part of the Multi-Die Interconnect Equation

The semiconductor industry is doubling down on multi-die systems-in-package (SiPs) to push performance, yields, and scalability. 

But as Dr. Wang-Jin Chen highlights in his EE Times article, A System Architect’s Guide to Multi-Die Interconnect (July 23, 2025), every decision in partitioning a system—from die stacking via hybrid bonding and microbumps to silicon or organic interposers—creates a layered hierarchy of interconnects. Each layer has its own bandwidth, latency, and power tradeoffs, making early architectural decisions critical.

The article notes that:

• Hybrid bonding can approach on-die density (400 nm pitch wafer-on-wafer) but brings significant yield and cost challenges.

• Microbumps (20–40 µm pitch) are more mature and supply-chain friendly but sacrifice density and increase impedance.

• 2.5D interposers force data onto serialized UCIe or PCIe-style links, adding latency, power overhead, and complexity.

What’s often left out of this conversation is electromagnetic interference (EMI)—a silent design killer as systems scale. Every interconnect layer introduces potential emissions and susceptibility points that can derail performance and force costly filtering or shielding retrofits.

At Slip Signal Technologies, EMI resilience needs to be designed in, not bolted on. Our SEDL technology suppresses interference at the source, eliminating the need for bulky filters, freeing 15–20% PCB space, and enabling lighter, more efficient designs—a game-changer for aerospace and defense, where every kilogram saved can mean millions in program cost reductions.

As SiPs become the backbone of data centers, aerospace systems, and defense electronics, we echo Dr. Chen’s call for early collaboration among interconnect, packaging, and system architects. 

But we’d add: bring in EMI experts early, too. It’s the only way to unlock the full promise of multi-die designs without running into compliance or performance roadblocks.